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Proceedings Paper

A silicon photonic WDM network for high-performance macrochip communications
Author(s): Xuezhe Zheng; Pranay Koka; Herb Schwetman; Jon Lexau; Ron Ho; Ivan Shubin; John E. Cunningham; Ashok V. Krishnamoorthy
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Paper Abstract

We introduce a novel approach to interconnect multiple chips together with a silicon photonic WDM point-to-point network enabled by optical proximity communications to act as a single large piece of logical silicon much larger than a single reticle limit. We call this structure a macrochip. This non-blocking network provides all-to-all low-latency connectivity while maximizing bisection bandwidth, making it ideal for multi-core and multi-processor interconnections. We envision bisection bandwidth up to TBps for an 8x8 macrochip design. And a 5-6x improvement in latency can be achieved when compared to a purely electronic implementation. We also observe better overall performance over other optical network architectures.

Paper Details

Date Published: 12 February 2009
PDF: 10 pages
Proc. SPIE 7221, Photonics Packaging, Integration, and Interconnects IX, 72210E (12 February 2009); doi: 10.1117/12.813420
Show Author Affiliations
Xuezhe Zheng, Sun Microsystems, Inc. (United States)
Pranay Koka, Sun Microsystems, Inc. (United States)
Herb Schwetman, Sun Microsystems, Inc. (United States)
Jon Lexau, Sun Microsystems, Inc. (United States)
Ron Ho, Sun Microsystems, Inc. (United States)
Ivan Shubin, Sun Microsystems, Inc. (United States)
John E. Cunningham, Sun Microsystems, Inc. (United States)
Ashok V. Krishnamoorthy, Sun Microsystems, Inc. (United States)


Published in SPIE Proceedings Vol. 7221:
Photonics Packaging, Integration, and Interconnects IX
Alexei L. Glebov; Ray T. Chen, Editor(s)

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