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Proceedings Paper

Optical proximity communication
Author(s): Ivan Shubin; John E. Cunningham; Xuezhe Zheng; John Simons; Dazeng Feng; Hong Liang; Cheng-Chih Kung; Mehdi Asghari; Ashok V. Krishnamoorthy
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Paper Abstract

We review 10Gb/sec Optical Proximity Communication realized with packaged chips that carry SOI optical waveguides and reflecting mirrors micromachined in silicon. The high precision chip to chip alignment and placement was enabled by a new packaging concept based on the co-integration of pyramidal pit features defined by anisotropic silicon etch and matching high precision micro-spheres. We support this novel packaging approach with measured optical transmission data and discuss the extent of it towards other applications of Proximity Communication.

Paper Details

Date Published: 10 February 2009
PDF: 8 pages
Proc. SPIE 7219, Optoelectronic Integrated Circuits XI, 721902 (10 February 2009); doi: 10.1117/12.813415
Show Author Affiliations
Ivan Shubin, Sun Microsystems, Inc. (United States)
John E. Cunningham, Sun Microsystems, Inc. (United States)
Xuezhe Zheng, Sun Microsystems, Inc. (United States)
John Simons, Sun Microsystems, Inc. (United States)
Dazeng Feng, Kotura Inc. (United States)
Hong Liang, Kotura Inc. (United States)
Cheng-Chih Kung, Kotura Inc. (United States)
Mehdi Asghari, Kotura Inc. (United States)
Ashok V. Krishnamoorthy, Sun Microsystems, Inc. (United States)

Published in SPIE Proceedings Vol. 7219:
Optoelectronic Integrated Circuits XI
Louay A. Eldada; El-Hang Lee, Editor(s)

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