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Proceedings Paper

Diffusion of acid and amine at resist/BARC interface
Author(s): Masamitsu Shirai; Noriaki Majima; Haruyuki Okamura; Yoshiomi Hiroi; Shigeo Kimura; Yasuyuki Nakajima
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Paper Abstract

In chemically amplified (CA) resist process, photo-chemically generated acid is needed to diffuse in resist matrix to induce the de-blocking reaction. The concentration of acid in resist matrix should be constant during the post-exposure-bake (PEB) treatment. Organic bottom anti-reflective coating (BARC) is essentially important to provide reflectivity control for resist patterning. In some cases, the photochemically generated acid and amine added as a quencher can diffuse from resist layer to BARC layer, which causes the footing or undercut of resist patterns. In this study, we have devised novel concept to qualitatively observe the diffusion of acids and amines from resist layer to BARC layer and vice versa. The rate of de-blocking reaction of CA resist was used to estimate the amount of acid in resist layer. It was found that the acid in resist layer can diffuse into BARC layer and the acid in BARC layer can also diffuse into resist layer during PEB treatment. Diffusion efficiency of the acid at resist / BARC interface was dependent on the chemical structure of resist and crosslinking density of BARC materials. Diffusion of amines from resist layer to BARC layer was negligible.

Paper Details

Date Published: 1 April 2009
PDF: 8 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 727331 (1 April 2009); doi: 10.1117/12.813379
Show Author Affiliations
Masamitsu Shirai, Osaka Prefecture Univ. (Japan)
Noriaki Majima, Osaka Prefecture Univ. (Japan)
Haruyuki Okamura, Osaka Prefecture Univ. (Japan)
Yoshiomi Hiroi, Nissan Chemical Industries, Ltd. (Japan)
Shigeo Kimura, Nissan Chemical Industries, Ltd. (Japan)
Yasuyuki Nakajima, Nissan Chemical Industries, Ltd. (Japan)

Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

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