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Proceedings Paper

Fast analysis and diagnostics for improving overlay control: moving beyond the black box approach
Author(s): Yi-An Liu; Wei-Ming Wu; Hsiao-Chiang Lin; Jun-Cheng (Nelson) Lai; Chin-Chou (Kevin) Huang; Hsing-Chien (Robert) Wu; Healthy Huang; David Tien
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Paper Abstract

Controlling overlay residuals to the lowest possible levels is critical for high yielding mass production success and is one of the most pressing challenges for lithographers. In this paper, the authors will show how the use of certain systematic diagnostic and analysis tools combined with a source of variance methodology can allow users to promptly separate the overlay sources of error into different contributors and quickly make the proper corrections. This methodology with the analysis tools provide a turnkey solution to help process and equipment engineers take fast decisions and act quickly to overcome these overlay challenges, which is one of the key contributing factors to staying ahead.

Paper Details

Date Published: 23 March 2009
PDF: 7 pages
Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72722Z (23 March 2009); doi: 10.1117/12.812478
Show Author Affiliations
Yi-An Liu, Powerchip Semiconductor Corp. (Taiwan)
Wei-Ming Wu, Powerchip Semiconductor Corp. (Taiwan)
Hsiao-Chiang Lin, Powerchip Semiconductor Corp. (Taiwan)
Jun-Cheng (Nelson) Lai, Powerchip Semiconductor Corp. (Taiwan)
Chin-Chou (Kevin) Huang, KLA-Tencor Corp. (United States)
Hsing-Chien (Robert) Wu, KLA-Tencor Corp. (United States)
Healthy Huang, KLA-Tencor Corp. (United States)
David Tien, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 7272:
Metrology, Inspection, and Process Control for Microlithography XXIII
John A. Allgair; Christopher J. Raymond, Editor(s)

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