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Proceedings Paper

The measurement uncertainty challenge for the future technological nodes production and development
Author(s): J. Foucher; P. Faurie; A.-L. Foucher; M. Cordeau; V. Farys
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Paper Abstract

With the continuous shrinkage of dimensions in the semiconductor industry, the measurement uncertainty is becoming one of the major component that have to be controlled in order to guarantee sufficient production yield for the next technological nodes production. Thus, CD-SEM and Scatterometry techniques have to face new challenges in term of accuracy and subsequently new challenges in measurement uncertainty that were not really taken into account at the origin of their introduction in production. In this paper, we will present and discuss results about the accuracy requirements related to key applications for advanced technological nodes production. Thus, we will present results related to OPC model precision improvement by using suitable reference metrology model based on the 3D-AFM technique use. An interesting study related to 193 resist shrinkage during CD-SEM measurement will be also presented and therefore the impact on measurement uncertainty will be discussed. Finally we will conclude this paper by showing the potential industrial benefits to use a simple but relevant 3D-AFM reference metrology model use into the semiconductor production environment.

Paper Details

Date Published: 23 March 2009
PDF: 9 pages
Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72721K (23 March 2009); doi: 10.1117/12.812446
Show Author Affiliations
J. Foucher, CEA, LETI, Minatec (France)
P. Faurie, CEA, LETI, Minatec (France)
A.-L. Foucher, CEA, LETI, Minatec (France)
M. Cordeau, CEA, LETI, Minatec (France)
V. Farys, STMicroelectronics (France)


Published in SPIE Proceedings Vol. 7272:
Metrology, Inspection, and Process Control for Microlithography XXIII
John A. Allgair; Christopher J. Raymond, Editor(s)

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