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Proceedings Paper

Wafer-level optics enables low cost camera phones
Author(s): Yehudit Dagan
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Paper Abstract

To meet market demand and enable the proliferation of camera phones for developing countries, manufacturers must be able to meet requirements for camera modules that are reduced in size and cost. Conventional camera-module technology is heading towards an asymptote, where the optics no longer scale with the required size, performance, and cost. Using wafer-level techniques and reflow compatible materials to manufacture the optics together with wafer-level chip scale packaging (WLCSP) of image sensors enables manufacturing of smaller-size, lower-cost, reflow-compatible camera modules. Focusing on VGA resolution, this paper will present a comparison between optical modules that were built using conventional technology and wafer-level technology.

Paper Details

Date Published: 9 February 2009
PDF: 8 pages
Proc. SPIE 7218, Integrated Optics: Devices, Materials, and Technologies XIII, 72180P (9 February 2009); doi: 10.1117/12.811609
Show Author Affiliations
Yehudit Dagan, Tessera, Inc. (United States)

Published in SPIE Proceedings Vol. 7218:
Integrated Optics: Devices, Materials, and Technologies XIII
Jean-Emmanuel Broquin; Christoph M. Greiner, Editor(s)

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