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Proceedings Paper

Scalable (24-140 Gbps) optical data link well adapted for future maskless lithography applications
Author(s): A. Paraskevopoulos; S.-H. Voss; M. Talmi; G. Walf
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Paper Abstract

Maskless lithography based on electron beam parallelization requires well adapted data links, capable of transmitting the corresponding data volume at rates up to the Tbps domain. In this paper we focus on a scalable (24 - 140 Gbps) optical data link, well adapted for future implementation in maskless lithography systems. The link comprises a high-speed data buffer with synchronizable architecture and scalable throughput (N x 24 Gbps), an optical free space transmission solution, a 45 channel low-noise optical receiver chip based on BiCMOS 0.6 micron technology and, finally, a Data Processor & Demux IP core implemented in VHDL.

Paper Details

Date Published: 17 March 2009
PDF: 11 pages
Proc. SPIE 7271, Alternative Lithographic Technologies, 72711I (17 March 2009); doi: 10.1117/12.811495
Show Author Affiliations
A. Paraskevopoulos, Fraunhofer-Institut for Telecommunications, Heinrich-Hertz-Institut (Germany)
S.-H. Voss, Fraunhofer-Institut for Telecommunications, Heinrich-Hertz-Institut (Germany)
M. Talmi, Fraunhofer-Institut for Telecommunications, Heinrich-Hertz-Institut (Germany)
G. Walf, Fraunhofer-Institut for Telecommunications, Heinrich-Hertz-Institut (Germany)


Published in SPIE Proceedings Vol. 7271:
Alternative Lithographic Technologies
Frank M. Schellenberg; Bruno M. La Fontaine, Editor(s)

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