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Proceedings Paper

Optical interconnects for board level applications
Author(s): R. Dangel; R. Beyeler; N. Meier; T. Lamprecht; F. Horst; D. Jubin; J. Weiss; B. J. Offrein
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Paper Abstract

Optical link technology will play an increasingly important role for board-level interconnects in servers and supercomputers as a means to keep pace with the increasing intra-system bandwidth requirements. Low-cost and high density optical packaging concepts are required. We describe the development of board-level interconnects based on polymer waveguide technology. In this paper, we focus on flexible optical waveguide sheets and the passive alignment of optical connectors.

Paper Details

Date Published: 10 February 2009
PDF: 7 pages
Proc. SPIE 7219, Optoelectronic Integrated Circuits XI, 721904 (10 February 2009); doi: 10.1117/12.811128
Show Author Affiliations
R. Dangel, IBM Research GmbH (Switzerland)
R. Beyeler, IBM Research GmbH (Switzerland)
N. Meier, IBM Research GmbH (Switzerland)
T. Lamprecht, IBM Research GmbH (Switzerland)
F. Horst, IBM Research GmbH (Switzerland)
D. Jubin, IBM Research GmbH (Switzerland)
J. Weiss, IBM Research GmbH (Switzerland)
B. J. Offrein, IBM Research GmbH (Switzerland)


Published in SPIE Proceedings Vol. 7219:
Optoelectronic Integrated Circuits XI
Louay A. Eldada; El-Hang Lee, Editor(s)

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