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Proceedings Paper

Fe-incorporation into mesoporous SBA-15 materials by direct synthesis and post-synthesis
Author(s): Phuong Tuyet Dang; Hoan Vuong Thi Nguyen; Hy Gia Le; Yen Hoang; Thang Cao Dinh; Linh H. T. Bui; Hoa Kim Thi Tran; Thang Vinh Hoang; Tuan Anh Vu
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Paper Abstract

Fe containing SBA-15 mesoporous material was successfully prepared by direct synthesis and post-synthesis (atomic implantation) methods. The obtained Fe-SBA-15 samples were characterized by different techniques such as XRD, BET, TEM and UV-Vis. It showed that for both methods, Fe containing SBA-15 samples have highly ordered hexagonal nano-structure with large pore size. It revealed the existence of both Fe species: Fe-tetrahedral coordinated and Fe-highly dispersed species. However, higher portion of Fe-highly dispersed species in the samples prepared post-synthesis (atomic implantation) was found. The Fe-SBA-15 catalysts were tested in catalytic oxidation of phenol and red phenol. The results indicated that both Fe-incorporated and Fe-highly dispersed species were active sites. However, the latter exhibited higher activity compared to the former ones.

Paper Details

Date Published: 30 December 2008
PDF: 8 pages
Proc. SPIE 7267, Smart Materials V, 726718 (30 December 2008); doi: 10.1117/12.810710
Show Author Affiliations
Phuong Tuyet Dang, Vietnamese Academy of Science and Technology (Viet Nam)
Hoan Vuong Thi Nguyen, Vietnamese Academy of Science and Technology (Viet Nam)
Hy Gia Le, Vietnamese Academy of Science and Technology (Viet Nam)
Yen Hoang, Vietnamese Academy of Science and Technology (Viet Nam)
Thang Cao Dinh, Vietnamese Academy of Science and Technology (Viet Nam)
Linh H. T. Bui, Vietnamese Academy of Science and Technology (Viet Nam)
Hoa Kim Thi Tran, Vietnamese Academy of Science and Technology (Viet Nam)
Thang Vinh Hoang, Vietnamese Academy of Science and Technology (Viet Nam)
Tuan Anh Vu, Vietnamese Academy of Science and Technology (Viet Nam)


Published in SPIE Proceedings Vol. 7267:
Smart Materials V
Nicolas H. Voelcker; Helmut W. Thissen, Editor(s)

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