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Proceedings Paper

Advances in high-power laser diode packaging
Author(s): Ed Wolak; Cameron Mitchell; Trevor Crum; Oscar Romero; John Gloyd; Daming Liu; Serge Cutillas; Sang-Ki Park; Kelly Johnson; Xu Jin; Hanxuan Li; Terry Towe; Irving Chyr; Robert Miller; Arne Meissner; Dino Lenarduzzi; James Harrison
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Paper Abstract

High-power, packaged diode-laser sources continue to evolve through co-engineering of epitaxial design, beam conditioning and thermal management. Here we review examples of improvements made to key attributes including reliable power, brightness, power per unit volume and value.

Paper Details

Date Published: 12 February 2009
PDF: 9 pages
Proc. SPIE 7221, Photonics Packaging, Integration, and Interconnects IX, 72210U (12 February 2009); doi: 10.1117/12.810549
Show Author Affiliations
Ed Wolak, Newport Spectra-Physics (United States)
Cameron Mitchell, Newport Spectra-Physics (United States)
Trevor Crum, Newport Spectra-Physics (United States)
Oscar Romero, Newport Spectra-Physics (United States)
John Gloyd, Newport Spectra-Physics (United States)
Daming Liu, Newport Spectra-Physics (United States)
Serge Cutillas, Newport Spectra-Physics (United States)
Sang-Ki Park, Newport Spectra-Physics (United States)
Kelly Johnson, Newport Spectra-Physics (United States)
Xu Jin, Newport Spectra-Physics (United States)
Hanxuan Li, Newport Spectra-Physics (United States)
Terry Towe, Newport Spectra-Physics (United States)
Irving Chyr, Newport Spectra-Physics (United States)
Robert Miller, Newport Spectra-Physics (United States)
Arne Meissner, Newport Spectra-Physics (United States)
Dino Lenarduzzi, Newport Spectra-Physics (United States)
James Harrison, Newport Spectra-Physics (United States)


Published in SPIE Proceedings Vol. 7221:
Photonics Packaging, Integration, and Interconnects IX
Alexei L. Glebov; Ray T. Chen, Editor(s)

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