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Proceedings Paper

Packaging influence on laser bars of different dimensions
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Paper Abstract

The reliability of high-power diode laser bars is limited by the thermo-mechanical stress occurring during the packaging process and operation. The stress is caused by the mismatch of the thermal expansion coefficients between heat sink and laser bar. In general the stress influence grows with the bar size. The development of tapered laser bars leads to higher cavity lengths so the thermo-mechanical stress in the longitudinal direction becomes more important. In this work the packaging influences on different sized laser bars are compared. At first thermal and thermo-mechanical influences are evaluated in FEM-simulations. Afterwards laser bars of different lengths and widths are mounted and characterized. The occurring strain is analyzed by electroluminescence using the correlation between stress and polarization properties of the laser bar radiation. Because of the correlation between temperature and wavelength, a thermal analysis of the mounted laser bars can be done by emitter resolved spectra scanning. The influence on reliability is analyzed in an aging study with intermediate characterization steps.

Paper Details

Date Published: 23 February 2009
PDF: 8 pages
Proc. SPIE 7198, High-Power Diode Laser Technology and Applications VII, 71980K (23 February 2009); doi: 10.1117/12.810483
Show Author Affiliations
Thomas Westphalen, Fraunhofer Institute for Laser Technology (Germany)
Michael Leers, Fraunhofer Institute for Laser Technology (Germany)
Marcel Werner, Fraunhofer Institute for Laser Technology (Germany)
Martin Traub, Fraunhofer Institute for Laser Technology (Germany)
Hans-Dieter Hoffmann, Fraunhofer Institute for Laser Technology (Germany)
Ralf Ostendorf, Fraunhofer Institute for Applied Solid State Physics (Germany)


Published in SPIE Proceedings Vol. 7198:
High-Power Diode Laser Technology and Applications VII
Mark S. Zediker, Editor(s)

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