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Proceedings Paper

Thermal expansion coefficient and electrical resistivity of nonuniform temperature specimen
Author(s): Chunsuo Xin; Jingmin Dai; Qiang Wang; Xiaowa He
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Paper Abstract

A new computing method is proposed for the measurement of the thermalphysical parameters of specimens with nonuniform temperature profile distributions. The calculation method is derived from the temperature dependence of the thermal properties, and can be applied to the measurement of the longitudinal thermal expansion coefficient and electrical resistivity. The cross section of the entire specimen is uniform at room temperature and the changes during the experiments are ignored in this method. If the temperatures are measured at equal intervals, the specimen may be considered as consisting of M equal segments and each of them is S long. The corresponding length and resistance of these segments at temperature T0 may be of any value. If the changes in length and temperature distribution of the specimen are measured, the temperature dependence of the thermal expansion coefficient can be worked out using this method. If the resistance and temperature distribution of the specimen are measured, the electrical resistivity versus temperature function of the specimen, which is corrected by thermal expansion, can be obtained as well. The validity of the computing method of thermal expansion coefficient and electrical resistivity is verified through computer simulation. The maximum 'measurement' error of electrical resistivity is 3.3%.

Paper Details

Date Published: 12 January 2009
PDF: 7 pages
Proc. SPIE 7133, Fifth International Symposium on Instrumentation Science and Technology, 71333F (12 January 2009); doi: 10.1117/12.810482
Show Author Affiliations
Chunsuo Xin, Harbin Institute of Technology (China)
Jingmin Dai, Harbin Institute of Technology (China)
Qiang Wang, Harbin Institute of Technology (China)
Xiaowa He, Aerospace Research Institute of Materials and Processing Technology (China)


Published in SPIE Proceedings Vol. 7133:
Fifth International Symposium on Instrumentation Science and Technology
Jiubin Tan; Xianfang Wen, Editor(s)

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