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Proceedings Paper

A multi-function tribological probe microscope with a hot tip for thermal measurement
Author(s): Z. Yue; X. Liu; Z. Cai; P. Cai
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Paper Abstract

Surface mechanical and thermal properties objectively affect our touch-feel perception. However, it is still far from known that how the surface properties affect the stimulus to our nerve system and make us feel warm or cold, hard or soft, rough or smooth, etc. Physically, although the surface properties can be measured individually by different instruments, it is desirable to have a multifunctional instrument to facilitate the investigation of the relationship between the surface physical characteristics and the corresponding perceived touch feeling by human. In our previous work, a novel multi-functional tribological probe microscope (TPM) was developed to provide mappings of four functions of a surface at micro and nanometer scales. The four functions of surface topography, hardness, Young's modulus and friction are measured in a single scan set-up and they are potentially linked in space and time to provide cross-correlation in between. In this paper, to achieve the additional function of micro thermal analysis, we proposed a new scheme of thermal probe with a hot wire (Wollaston wire) buried beneath a Berkovich diamond indenter. The details of mechanical design and associated electronic circuits are presented. Meanwhile, the paper also explains the principle of the hot-tip technique by relating its signals to established physical parameters of materials, a method that separates sample information from the artifact caused by the indentation geometry of the diamond tip. Experimental results of thermal conductivity measurements on certain metal specimens are discussed.

Paper Details

Date Published: 12 January 2009
PDF: 7 pages
Proc. SPIE 7133, Fifth International Symposium on Instrumentation Science and Technology, 71334L (12 January 2009); doi: 10.1117/12.810479
Show Author Affiliations
Z. Yue, Univ. of Warwick (United Kingdom)
X. Liu, Univ. of Warwick (United Kingdom)
Z. Cai, Univ. of Warwick (United Kingdom)
P. Cai, Shanghai Jiao Tong Univ. (China)


Published in SPIE Proceedings Vol. 7133:
Fifth International Symposium on Instrumentation Science and Technology
Jiubin Tan; Xianfang Wen, Editor(s)

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