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Proceedings Paper

Test procedures and artefacts for optical coordinate metrology
Author(s): Ulrich Neuschaefer-Rube; Wiebke Ehrig; Michael Neugebauer; Klaus Wendt
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Paper Abstract

Optical measurements are performed in coordinate metrology in a wide range of applications, ranging from large-scale workpieces with dimensions of several meters down to microstructures with &mgr;m-dimensions, using a large number of different measurement devices and sensors. These different devices and sensors must be tested to check their compliance with the specifications, to trace back the measurement results and to compare different devices. Thus, appropriate procedures and measurement standards (artefacts) are necessary. We present test procedures and artefacts for optical measurement systems similar to the well-known test procedures for classical tactile coordinate measuring machines (CMMs) according to the international standard ISO 10360. It is important that the surface characteristic of the artefacts is cooperative to the sensor. Appropriate artefacts were realized and tested. The main focus of this paper is on micro-artefacts. Furthermore, task-related standards to trace back specific measurement tasks were developed. By means of micro-contour artefacts, the measurement characteristics on critical geometries can be evaluated and compared. By means of a micro-gear standard, the measurement uncertainty on micro-planetary gear can be evaluated. The measurement deviations of measurement systems in the automotive industry can be determined with the special artefacts to test sensors for inline measurements.

Paper Details

Date Published: 12 January 2009
PDF: 9 pages
Proc. SPIE 7133, Fifth International Symposium on Instrumentation Science and Technology, 713304 (12 January 2009); doi: 10.1117/12.810474
Show Author Affiliations
Ulrich Neuschaefer-Rube, Physikalisch-Technische Bundesanstalt (Germany)
Wiebke Ehrig, Physikalisch-Technische Bundesanstalt (Germany)
Michael Neugebauer, Physikalisch-Technische Bundesanstalt (Germany)
Klaus Wendt, Physikalisch-Technische Bundesanstalt (Germany)

Published in SPIE Proceedings Vol. 7133:
Fifth International Symposium on Instrumentation Science and Technology
Jiubin Tan; Xianfang Wen, Editor(s)

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