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Proceedings Paper

Rapid and minimally invasive quantum cascade wafer testing
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Paper Abstract

Quantum Cascade (QC) wafer quality testing requires intensive processing and characterization. Here, we demonstrate a minimally invasive technique that gives rapid feedback on wafer quality. A mesa is fabricated using only a single etch and metallization step. The device is electrically pumped and optically and electrically characterized. The peak wavelength position and the full width at half maximum (FWHM) as a function of applied electric field, turn-on voltage, maximum operating current density and threshold current density of the mesas are measured. Results of the mesa and lasers processed from the same wafer are compared and differed by less than 10 %.

Paper Details

Date Published: 3 February 2009
PDF: 8 pages
Proc. SPIE 7230, Novel In-Plane Semiconductor Lasers VIII, 72300T (3 February 2009); doi: 10.1117/12.810258
Show Author Affiliations
Ekua N. Bentil, Princeton Univ. (United States)
Fatima Toor, Princeton Univ. (United States)
Anthony J. Hoffman, Princeton Univ. (United States)
Matthew D. Escarra, Princeton Univ. (United States)
Claire F. Gmachl, Princeton Univ. (United States)


Published in SPIE Proceedings Vol. 7230:
Novel In-Plane Semiconductor Lasers VIII
Alexey A. Belyanin; Peter M. Smowton, Editor(s)

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