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Proceedings Paper

Optical link by using optical wiring method for reducing EMI
Author(s): In-Kui Cho; Jong-Hwa Kwon; Sung-Woong Choi; Alexander Bondarik; Je-Hoon Yun; Chang-Joo Kim; Seung-Beom Ahn; Myung-Yung Jeong; Hyo Hoon Park
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Paper Abstract

A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and susceptibility. This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the following steps: (i) forming a light source device, an optical detection device, and an optical transmission unit on a substrate (metal optical bench (MOB)); (ii) preparing a flexible optical transmission-connection medium (optical wiring link) to optically connect the light source device formed on the substrate with the optical detection device; and (iii) directly connecting one end of the surface-finished optical transmission connection medium with the light source device and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto- electronics), the purely optical part and optical link(interconnection) is free of these problems. 1 An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data transmission rate without EMI problems.

Paper Details

Date Published: 30 December 2008
PDF: 8 pages
Proc. SPIE 7268, Smart Structures, Devices, and Systems IV, 72680I (30 December 2008); doi: 10.1117/12.810220
Show Author Affiliations
In-Kui Cho, Electronics and Telecommunications Research Institute (Korea, Republic of)
Jong-Hwa Kwon, Electronics and Telecommunications Research Institute (Korea, Republic of)
Sung-Woong Choi, Electronics and Telecommunications Research Institute (Korea, Republic of)
Alexander Bondarik, Electronics and Telecommunications Research Institute (Korea, Republic of)
Je-Hoon Yun, Electronics and Telecommunications Research Institute (Korea, Republic of)
Chang-Joo Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)
Seung-Beom Ahn, Hongik Univ. (Korea, Republic of)
Myung-Yung Jeong, Pusan National Univ. (Korea, Republic of)
Hyo Hoon Park, Information and Communications Univ. (Korea, Republic of)


Published in SPIE Proceedings Vol. 7268:
Smart Structures, Devices, and Systems IV
Said Fares Al-Sarawi; Vijay K. Varadan; Neil Weste; Kourosh Kalantar-Zadeh, Editor(s)

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