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Proceedings Paper

A study of material removal rates for shallow drilling with an ultrashort pulse laser
Author(s): B. R. Campbell; L. A. Forster; J. A. Moore; T. M. Lehecka; J. G. Thomas; V. V. Semak
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Paper Abstract

Using a commercial laser system operating at a 532 nm wavelength with 10 ps pulses, experiments were conducted on polished metal samples to study material removal characteristics from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of energy and various double pulse machining methods were examined. The results from changing the pulse separation for double pulse drilling are compared to prior work with picosecond and nanosecond pulse lasers.

Paper Details

Date Published: 24 February 2009
PDF: 9 pages
Proc. SPIE 7201, Laser Applications in Microelectronic and Optoelectronic Manufacturing VII, 72010I (24 February 2009); doi: 10.1117/12.810173
Show Author Affiliations
B. R. Campbell, The Pennsylvania State Univ. (United States)
L. A. Forster, The Pennsylvania State Univ. (United States)
J. A. Moore, The Pennsylvania State Univ. (United States)
T. M. Lehecka, The Pennsylvania State Univ. (United States)
J. G. Thomas, The Pennsylvania State Univ. (United States)
V. V. Semak, The Pennsylvania State Univ. (United States)


Published in SPIE Proceedings Vol. 7201:
Laser Applications in Microelectronic and Optoelectronic Manufacturing VII
Michel Meunier; Andrew S. Holmes; Hiroyuki Niino; Bo Gu, Editor(s)

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