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Proceedings Paper

Cost-effective method of manufacturing a 3D MEMS optical switch
Author(s): Emily Carr; Ping Zhang; Doug Keebaugh; Kelvin Chau
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Paper Abstract

growth of data and video transport networks. All-optical switching eliminates the need for optical-electrical conversion offering the ability to switch optical signals transparently: independent of data rates, formats and wavelength. It also provides network operators much needed automation capabilities to create, monitor and protect optical light paths. To further accelerate the market penetration, it is necessary to identify a path to reduce the manufacturing cost significantly as well as enhance the overall system performance, uniformity and reliability. Currently, most MEMS optical switches are assembled through die level flip-chip bonding with either epoxies or solder bumps. This is due to the alignment accuracy requirements of the switch assembly, defect matching of individual die, and cost of the individual components. In this paper, a wafer level assembly approach is reported based on silicon fusion bonding which aims to reduce the packaging time, defect count and cost through volume production. This approach is successfully demonstrated by the integration of two 6-inch wafers: a mirror array wafer and a "snap-guard" wafer, which provides a mechanical structure on top of the micromirror to prevent electrostatic snap-down. The direct silicon-to-silicon bond eliminates the CTEmismatch and stress issues caused by non-silicon bonding agents. Results from a completed integrated switch assembly will be presented, which demonstrates the reliability and uniformity of some key parameters of this MEMS optical switch.

Paper Details

Date Published: 18 February 2009
PDF: 8 pages
Proc. SPIE 7204, Micromachining and Microfabrication Process Technology XIV, 720402 (18 February 2009); doi: 10.1117/12.810065
Show Author Affiliations
Emily Carr, Glimmerglass Networks (United States)
Ping Zhang, Glimmerglass Networks (United States)
Doug Keebaugh, Glimmerglass Networks (United States)
Kelvin Chau, Glimmerglass Networks (United States)

Published in SPIE Proceedings Vol. 7204:
Micromachining and Microfabrication Process Technology XIV
Mary-Ann Maher; Jung-Chih Chiao; Paul J. Resnick, Editor(s)

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