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Proceedings Paper

Memory rich applications for 3D integration
Author(s): Paul D. Franzon; Steven Lipa; Julie Oh; Thor Thorolfsson; Rhett Davis
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Paper Abstract

3D stacking and integration can provide system advantages equivalent to up to two technology nodes of scaling. This paper explores memory rich applications for 3DIC. It shows how memory power and memory bandwidth can both be improved by an order of magnitude through 3D integration, and specifically explores a DSP application.

Paper Details

Date Published: 30 December 2008
PDF: 5 pages
Proc. SPIE 7268, Smart Structures, Devices, and Systems IV, 726809 (30 December 2008); doi: 10.1117/12.810061
Show Author Affiliations
Paul D. Franzon, North Carolina State Univ. (United States)
Steven Lipa, North Carolina State Univ. (United States)
Julie Oh, North Carolina State Univ. (United States)
Thor Thorolfsson, North Carolina State Univ. (United States)
Rhett Davis, North Carolina State Univ. (United States)


Published in SPIE Proceedings Vol. 7268:
Smart Structures, Devices, and Systems IV
Said Fares Al-Sarawi; Vijay K. Varadan; Neil Weste; Kourosh Kalantar-Zadeh, Editor(s)

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