Share Email Print
cover

Proceedings Paper

Fine leak batch testing of multiple MEMS packages
Author(s): Changsoo Jang; Byeng Dong Youn; Suk-Jin Ham; Bongtae Han
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

An analysis method for fine leak batch testing is developed for effective hermeticity inspection of metal-sealed MEMS packages in a mass production environment. It employs a forward-stepwise regression analysis based on a physical gas flow model to infer the information of leaky packages from batch test data. The proposed method can determine accurately the number of leaky packages and the true leak rate of each leaky package when the number of leaky packages in a batch is less than 5. A top-down hierarchical batch test is proposed as a reliable and effective test scheme by addressing this limitation of the developed analysis scheme.

Paper Details

Date Published: 9 February 2009
PDF: 6 pages
Proc. SPIE 7206, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII, 720605 (9 February 2009); doi: 10.1117/12.810004
Show Author Affiliations
Changsoo Jang, Univ. of Maryland, College Park (United States)
Byeng Dong Youn, Univ. of Maryland, College Park (United States)
Suk-Jin Ham, Samsung Electro-Mechanics (Korea, Republic of)
Bongtae Han, Univ. of Maryland, College Park (United States)


Published in SPIE Proceedings Vol. 7206:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
Richard C. Kullberg; Rajeshuni Ramesham, Editor(s)

© SPIE. Terms of Use
Back to Top