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Proceedings Paper

New packaging concepts for highly stable laser diode modules
Author(s): Ekkehard Werner; Sabine Kretzschmar; Guido Bonati; Ramona Eberhardt
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Paper Abstract

For mounting FAC lenses to diode lasers a new technology is introduced. Solder jet ball bumping is demonstrated to have the potential to replace conventional mounting technologies like adhesive bonding. The advantage of this method is a thermally and mechanically stable connection of micro optics and laser without drawbacks of outgasing and sensitivity to UV. The reached accuracy is within the range of one micrometer.

Paper Details

Date Published: 25 February 2009
PDF: 10 pages
Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 720204 (25 February 2009); doi: 10.1117/12.809978
Show Author Affiliations
Ekkehard Werner, JENOPTIK Laserdiode GmbH (Germany)
Sabine Kretzschmar, JENOPTIK Laserdiode GmbH (Germany)
Guido Bonati, JENOPTIK Laserdiode GmbH (Germany)
Ramona Eberhardt, Fraunhofer-Institut für Angewandte Optik und Feinmechanik (Germany)


Published in SPIE Proceedings Vol. 7202:
Laser-based Micro- and Nanopackaging and Assembly III
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako, Editor(s)

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