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Proceedings Paper

Out-of-plane coupling using thin glass based arrayed waveguide components
Author(s): H. Schröder; L. Brusberg; N. Arndt-Staufenbiel; T. Tekin
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Paper Abstract

Nano-photonics and electrical-optical integration are rapidly growing fields with a strong potential for applications in a wide spectrum covering optical sensing, data & telecommunication. Its merit of ultra compactness and planarity becoming a challenge since the periphery remained micro-level and out-of-plane coupling becomes necessary. We introduce new planar optical coupling elements for electrical-optical circuit boards, sensors and nano-devices. The novel photonic packaging technology using thin glass foils bridge the growing field of nano-photonics to the micro-photonic periphery. Innovative features are added to this technique to leverage its generic usage and first experimental results are presented.

Paper Details

Date Published: 12 February 2009
PDF: 8 pages
Proc. SPIE 7221, Photonics Packaging, Integration, and Interconnects IX, 72210D (12 February 2009); doi: 10.1117/12.809546
Show Author Affiliations
H. Schröder, Fraunhofer-Institute for Reliability and Microintegration (Germany)
L. Brusberg, Fraunhofer-Institute for Reliability and Microintegration (Germany)
N. Arndt-Staufenbiel, Technical Univ. of Berlin (Germany)
T. Tekin, Technical Univ. of Berlin (Germany)

Published in SPIE Proceedings Vol. 7221:
Photonics Packaging, Integration, and Interconnects IX
Alexei L. Glebov; Ray T. Chen, Editor(s)

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