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Proceedings Paper

Material survey for packaging semiconductor diode lasers
Author(s): David Schleuning; Kenneth Scholz; Mike Griffin; Bo Guo; Calvin Luong; Rajiv Pathak; Christian Scholz; Jason Watson; Heiko Winhold; Tom Hasenberg
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Paper Abstract

We present results from a survey of materials used for packaging semiconductor lasers, including Cu, CuW, BeO, diamond composite and other advanced materials. We present the results of residual bonding stress from various solders and consider the direct effects on wavelength and spectral width. We also provide data on the second order effects of threshold current and slow axis divergence. Additionally, we consider the heat spreading through different materials for a laser bar and present modeled and experimental data on the thermal performance. Finally, we consider the reliability under on-off life-testing and thermal cycling tests.

Paper Details

Date Published: 24 February 2009
PDF: 9 pages
Proc. SPIE 7198, High-Power Diode Laser Technology and Applications VII, 71981K (24 February 2009); doi: 10.1117/12.809314
Show Author Affiliations
David Schleuning, Coherent, Inc. (United States)
Kenneth Scholz, Coherent, Inc. (United States)
Mike Griffin, Coherent, Inc. (United States)
Bo Guo, Coherent, Inc. (United States)
Calvin Luong, Coherent, Inc. (United States)
Rajiv Pathak, Coherent, Inc. (United States)
Christian Scholz, Coherent, Inc. (United States)
Jason Watson, Coherent, Inc. (United States)
Heiko Winhold, Coherent, Inc. (United States)
Tom Hasenberg, Coherent, Inc. (United States)


Published in SPIE Proceedings Vol. 7198:
High-Power Diode Laser Technology and Applications VII
Mark S. Zediker, Editor(s)

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