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Proceedings Paper

Laser-based microbonding using hot melt adhesives
Author(s): G. Hemken; S. Böhm
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Paper Abstract

This paper presents an alternative adhesive bonding system which is able to join very small parts as well as relatively large parts with high accuracy requirements. The main advantages are the possibility to apply small volumes, to preapply the adhesive with a temporarily delayed joining procedure and extremely short set cycles. The center of micro joining develops suitable joining techniques on the basis of non-viscous adhesive systems (hot melts). The process development focuses on the suitability for automation, process times and the applicability of batch processes. The article discusses certain hot melt application techniques that are suitable for batch production e. g. the laser-sintering of hot melt powder, presents an adapted assembly system and shows an example of an automated assembly process for hot melt coated micro components. Therefore, using hot melts can be a technologically and economically interesting alternative for the assembly and packaging of MEMS.

Paper Details

Date Published: 24 February 2009
PDF: 9 pages
Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 72020I (24 February 2009); doi: 10.1117/12.808671
Show Author Affiliations
G. Hemken, Technische Univ. Braunschweig (Germany)
S. Böhm, Technische Univ. Braunschweig (Germany)

Published in SPIE Proceedings Vol. 7202:
Laser-based Micro- and Nanopackaging and Assembly III
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako, Editor(s)

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