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Proceedings Paper

Flexible optical interconnects based on silicon-containing polymers
Author(s): Ed Anzures; Roger Dangel; Rene Beyeler; Allie Cannon; Folkert Horst; Cecilia Kiarie; Phil Knudsen; Norbert Meier; Matt Moynihan; Bert Jan Offrein
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Paper Abstract

Formulations containing silicon-based polymers have been used for the formation of planar waveguides on flexible substrates. The substrate of choice is compatible with the flexible waveguide and is made of materials commonly utilized in the printed circuit board industry. When the flexible waveguide material is combined with the chosen substrate using processes compatible with printed circuit board manufacturing techniques, the resultant optical interconnects display sufficient flexibility, low optical loss (<0.05 dB/cm at 850 nm), and high reliability.

Paper Details

Date Published: 12 February 2009
PDF: 12 pages
Proc. SPIE 7221, Photonics Packaging, Integration, and Interconnects IX, 72210I (12 February 2009); doi: 10.1117/12.808396
Show Author Affiliations
Ed Anzures, Rohm and Haas Electronic Materials LLC (United States)
Roger Dangel, IBM Research GmbH (Switzerland)
Rene Beyeler, IBM Research GmbH (Switzerland)
Allie Cannon, Rohm and Haas Electronic Materials LLC (United States)
Folkert Horst, IBM Research GmbH (Switzerland)
Cecilia Kiarie, Rohm and Haas Electronic Materials LLC (United States)
Phil Knudsen, Rohm and Haas Electronic Materials LLC (United States)
Norbert Meier, IBM Research GmbH (Switzerland)
Matt Moynihan, Rohm and Haas Electronic Materials LLC (United States)
Bert Jan Offrein, IBM Research GmbH (Switzerland)


Published in SPIE Proceedings Vol. 7221:
Photonics Packaging, Integration, and Interconnects IX
Alexei L. Glebov; Ray T. Chen, Editor(s)

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