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Proceedings Paper

Low-stress dicing assisted by pulsed laser for multilayer MEMS
Author(s): Masayuki Fujita; Yusaku Izawa; Yosuke Tsurumi; Shuji Tanaka; Hideyuki Fukushi; Keiichi Sueda; Yoshiki Nakata; Noriaki Miyanaga; Masayoshi Esashi
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Paper Abstract

We have developed a novel debris-free in-air laser dicing technology, which is expected to give less failure of MEMS devices and hence improves yields. Our technology combines two processes: a dicing guide fabrication and a wafer separation process. The first process is internal transformation using a nanosecond Nd:YVO4 laser with high repetition rate and/or a pulsed fiber laser with 200ns pulsewidth. The laser pulses are focused inside the MEMS wafer without surface ablation. In order to make cross-sectional internal transformation, the laser beam is scanned several times with defocusing. The laser scanning speed per each scanning is 100-700 mm/sec depending on the layer material, the machining time is much faster than the conventional blade dicing. The second process is non-contact separation by thermally-induced crack propagation using a CO2 laser or mechanical separation by bending stress. In the each separation process, the internal transformation fabricated in the first process worked well as the guide of separation, and the processed wafer was diced with low stress. This dicing technology was applied for 4-inch MEMS wafers, e.g. pressure sensors, etc., and the sensor chips were separated without mechanical damages.

Paper Details

Date Published: 24 February 2009
PDF: 7 pages
Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 72020F (24 February 2009); doi: 10.1117/12.808370
Show Author Affiliations
Masayuki Fujita, Institute for Laser Technology (Japan)
Yusaku Izawa, Osaka Univ. (Japan)
Yosuke Tsurumi, Osaka Univ. (Japan)
Shuji Tanaka, Tohoku Univ. (Japan)
Hideyuki Fukushi, Tohoku Univ. (Japan)
Keiichi Sueda, Osaka Univ. (Japan)
Yoshiki Nakata, Osaka Univ. (Japan)
Noriaki Miyanaga, Osaka Univ. (Japan)
Masayoshi Esashi, Tohoku Univ. (Japan)

Published in SPIE Proceedings Vol. 7202:
Laser-based Micro- and Nanopackaging and Assembly III
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako, Editor(s)

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