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Proceedings Paper

Submicron writing by laser irradiation on metal nano-particle dispersed films toward flexible electronics
Author(s): Akira Watanabe; Mohammod Aminuzzaman; Tokuji Miyashita
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Paper Abstract

The requirement for microwiring technology by a wet process has significantly increased recently toward the achievement of printable and flexible electronics. We have developed the metal microwiring with a resolution higher than 1 μm by the laser direct writing technique using Ag and Cu nano-particle-dispersed films as precursors. The technique was applied to the microwiring on a flexible and transparent polymer film. The metallization is caused in a micro-region by focused laser beam, which reduces the thermal damage of the flexible polymer substrate during the metallization process. The laser direct writing technique is based on the efficient and fast conversion of photon energy to thermal energy by direct excitation of the plasmon absorption of a metal nano-particle, which provides Cu microwiring with a low resistivity owing to the inhibition of the surface oxidation of the Cu nano-particle.

Paper Details

Date Published: 24 February 2009
PDF: 15 pages
Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 720206 (24 February 2009); doi: 10.1117/12.808213
Show Author Affiliations
Akira Watanabe, Tohoku Univ. (Japan)
Mohammod Aminuzzaman, Tohoku Univ. (Japan)
Tokuji Miyashita, Tohoku Univ. (Japan)

Published in SPIE Proceedings Vol. 7202:
Laser-based Micro- and Nanopackaging and Assembly III
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako, Editor(s)

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