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Proceedings Paper

Laser brackets debonding: Tm:YAP, Nd:YAG, and GaAs diode lasers evaluation
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Paper Abstract

The study demonstrates the possibility of using laser radiation for the ceramic bracket removing. Three laser radiations were examined for this effect and the removing possibility and velocity together with enamel and root damage were investigated. A diode pumped Tm:YAP microchip laser generating a wavelength 1.9 μm, diode pumped Nd:YAG laser with 1.44 μm wavelength, GaAs diode with 0.808 μm were used for the debonding purpose. The measurement of transmission and absorption of the basic element - bracket, adhesive resin, and enamel was also made with the goal to explain the source of the heat and bracket debonding. The explanation of the debonding effect is also presented. From the results it is possible to conclude that continuously running diode pumped microchip Tm:YAP laser having output power 1W can be a good candidate for ceramic bracket debonding procedure.

Paper Details

Date Published: 24 February 2009
PDF: 6 pages
Proc. SPIE 7162, Lasers in Dentistry XV, 71620C (24 February 2009); doi: 10.1117/12.808137
Show Author Affiliations
Tat'jana Dostálová, Charles Univ. (Czech Republic)
Helena Jelínková, Czech Technical Univ. in Prague (Czech Republic)
Jan Šulc, Czech Technical Univ. in Prague (Czech Republic)
Petr Koranda, Czech Technical Univ. in Prague (Czech Republic)
Michal Němec, Czech Technical Univ. in Prague (Czech Republic)
Ilja Ivanov, Charles Univ. (Czech Republic)
Mitsunobu Miyagi, Sendai National College of Technology (Japan)
Katsumasa Iwai, Sendai National College of Technology (Japan)


Published in SPIE Proceedings Vol. 7162:
Lasers in Dentistry XV
Peter Rechmann; Daniel Fried, Editor(s)

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