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Proceedings Paper

Integration of InP-based optoelectronics with silicon waveguides
Author(s): Timo Aalto; Mikko Harjanne; Markku Kapulainen; Sami Ylinen; Jyrki Ollila; Ville Vilokkinen; Ludwig Mörl; Martin Möhrle; Régis Hamelin
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Paper Abstract

Compound semiconductors provide state-of-the-art performance in optoelectronics, while silicon-on-insulator (SOI) is an ideal platform for many passive functions in integrated optics. By combining them one can realise optical devices with high performance and low cost. This paper discusses the various applications and technologies for integrating InP chips with SOI waveguides. Bonding of lasers, SOA arrays and detectors for practical applications is described. Experimental results are given for visually aligned thermo-compression bonding and self-aligned flip-chip bonding with Indium bumps. Flip-chip bonding is reported directly on SOI chips, as well as on a separate silicon-optical-bench.

Paper Details

Date Published: 10 February 2009
PDF: 14 pages
Proc. SPIE 7218, Integrated Optics: Devices, Materials, and Technologies XIII, 72180O (10 February 2009); doi: 10.1117/12.808129
Show Author Affiliations
Timo Aalto, VTT Technical Research Ctr. of Finland (Finland)
Mikko Harjanne, VTT Technical Research Ctr. of Finland (Finland)
Markku Kapulainen, VTT Technical Research Ctr. of Finland (Finland)
Sami Ylinen, VTT Technical Research Ctr. of Finland (Finland)
Jyrki Ollila, VTT Technical Research Ctr. of Finland (Finland)
Ville Vilokkinen, Modulight, Inc. (Finland)
Ludwig Mörl, Fraunhofer HHI (Germany)
Martin Möhrle, Fraunhofer HHI (Germany)
Régis Hamelin, Intexys Photonics (France)


Published in SPIE Proceedings Vol. 7218:
Integrated Optics: Devices, Materials, and Technologies XIII
Jean-Emmanuel Broquin; Christoph M. Greiner, Editor(s)

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