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Proceedings Paper

Parametric investigation of solder bumping for assembly of optical components
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Paper Abstract

Laser based solder bumping is a highly flexible and fast approach for flux-free soldering of micro-optical components in complex 3D geometries with localized and time restricted energy input. Solder joints provide superior mechanical strength, higher radiation stability, humidity resistance and a good thermal and electrical conductivity compared to adhesive bonding. Due to the good long term stability solder joints are feasible for the integration of optical, mechanical, electronic, and MEMS/MOEMS devices in multi functional hybrid optical assemblies. Comparative studies of solder bumping of optical components with sputtered thin film metallization on platforms made of Alumina (Al2O3) and Low Temperature Cofired Ceramics (LTCC) with both Au and AgPd thick film metallization were carried out using design of experiment methods (DoE). The influence of the system parameters, laser pulse energy and duration, distance, incidence angle and nitrogen pressure on targeting accuracy and bond strength were evaluated. The jetting of liquid solder spheres within a localized nitrogen atmosphere improves wetting on the respective wetting surfaces and simplifies the joining process due to integration of solder alloy preform handling and reflowing, thus showing great potential for a high degree of automation.

Paper Details

Date Published: 25 February 2009
PDF: 10 pages
Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 720203 (25 February 2009); doi: 10.1117/12.807986
Show Author Affiliations
Thomas Burkhardt, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Friedrich-Schiller-Univ. Jena (Germany)
Marcel Hornaff, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Erik Beckert, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Ramona Eberhardt, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Andreas Tünnermann, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Friedrich-Schiller-Univ. Jena (Germany)


Published in SPIE Proceedings Vol. 7202:
Laser-based Micro- and Nanopackaging and Assembly III
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako, Editor(s)

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