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Proceedings Paper

Advanced-UV excimer laser processing
Author(s): Ralph Delmdahl
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Paper Abstract

High energy excimer lasers lend maximum flexibility to laser microprocessing, since virtually every material is amenable to accurate, high resolution material ablation without subsequent post treatment. Due to the UV photons provided with no up-conversion required as direct output by excimer lasers, output powers of many hundred watts are easily achievable and are key to high throughput, and up-scaling capability of manufacturing processes. In particular, the large flat-top excimer laser profile is well-suited for most efficient parallel processing of two and three dimensional microstructures. Compact micromachining concepts particularly suited for material ablation and surface activation will be introduced.

Paper Details

Date Published: 20 February 2009
PDF: 12 pages
Proc. SPIE 7196, High Energy/Average Power Lasers and Intense Beam Applications III, 719608 (20 February 2009); doi: 10.1117/12.807981
Show Author Affiliations
Ralph Delmdahl, Coherent GmbH (Germany)

Published in SPIE Proceedings Vol. 7196:
High Energy/Average Power Lasers and Intense Beam Applications III
Steven J. Davis; Michael C. Heaven; J. Thomas Schriempf, Editor(s)

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