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Proceedings Paper

Micro-scale large-area UV laser processing
Author(s): Ludolf Herbst; Jan Brune
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Paper Abstract

UV lasers are well-established sources for a wide variety of micro-machining applications. The small wavelength makes them ideal for processing of small features or to modify thin surfaces. Especially short pulse UV lasers are ideal for ablation of various materials, e. g., polyimide, parylene, PMMA, copper, gold and diamond. Furthermore these lasers are used for silicon annealing and patterning of fine circuitries to various substrates. The demand for smaller feature sizes of micro-mechanical and micro-electronic devices set new requirements in regard to resolution, throughput and overall cost efficiency of the process. In this paper, high-power excimer laser micro-machining and annealing relevant applications will be presented and discussed.

Paper Details

Date Published: 24 February 2009
PDF: 8 pages
Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 72020M (24 February 2009); doi: 10.1117/12.807828
Show Author Affiliations
Ludolf Herbst, Coherent GmbH (Germany)
Jan Brune, Coherent GmbH (Germany)

Published in SPIE Proceedings Vol. 7202:
Laser-based Micro- and Nanopackaging and Assembly III
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako, Editor(s)

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