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Proceedings Paper

Experimental study of roof filling rate during thermal bonding of polymer microchannel sealing
Author(s): Xudi Wang; Jingjing Lu; Yun Jiang; Liangjin Ge; Shaojun Fu
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Paper Abstract

Direct thermal bonding approaches are especially desirable as they allow formation of enclosed microchannels with uniform surfaces composed entirely of the same polymeric material. It is often believed that the main phenomenon involved during thermal bonding is a chain entanglement of the polymers over the boundary. If the temperature is too high and/or the application of the force is too long then the polymer will flow and refill the channels caused by capillary forces, called as roof filling phenomenon. In order to understand this process more fully, we describe an experimental method for characterizing the roof filling rate inside a microchannel by measuring the polymer marching velocity or position of a capillary meniscus during thermal bonding. 1D nanochannels was fabricated succesfully and the vertical dimension was well controlled according to the top filling mechnism.

Paper Details

Date Published: 3 February 2009
PDF: 6 pages
Proc. SPIE 7159, 2008 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications, 71590M (3 February 2009); doi: 10.1117/12.807059
Show Author Affiliations
Xudi Wang, Hefei Univ. of Technology (China)
Jingjing Lu, Hefei Univ. of Technology (China)
Yun Jiang, Hefei Univ. of Technology (China)
Liangjin Ge, Univ. of Science and Technology of China (China)
Shaojun Fu, Univ. of Science and Technology of China (China)


Published in SPIE Proceedings Vol. 7159:
2008 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications

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