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Proceedings Paper

Fast matching location algorithm based on mixed moment for wire bonding
Author(s): Fan zhi Kong; Xing zhou Zhang; Yi zhong Wang; Da wei Zhang; Jun lan LI
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Paper Abstract

Wire bonding is a solid phase welding process, where the two metallic materials (wire and pad surface) are brought into intimate contact. In order to ensure the accuracy and speed of bonding, micro-scoped pattern recognition systems (PRS) are often used to measure the deviation of the actual chip relative to the sampling position (eye-point). In this paper, a new mixed moment feature based matching algorithm is proposed for wire bonding. The important components of Zernike moments and wavelet moments are extracted to compose the mixed moment vector. The realization of location is by calculating the Euclidean distance of mixed moment vectors between the eye-point images and images to be matched. Experimental results show the rotation, translation invariance of the mixed moment features. The algorithm can improve the positioning accuracy while no increase in computational complexity, and can be well used in the precise positioning of the vision system for wire bonding.

Paper Details

Date Published: 3 February 2009
PDF: 9 pages
Proc. SPIE 7159, 2008 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications, 71590F (3 February 2009); doi: 10.1117/12.807010
Show Author Affiliations
Fan zhi Kong, Harbin Engineering Univ. (China)
Tianjin Univ. of Science and Technology (China)
Xing zhou Zhang, Harbin Engineering Univ. (China)
Yi zhong Wang, Tianjin Univ. of Science and Technology (China)
Da wei Zhang, Tianjin Univ. (China)
Jun lan LI, Tianjin Univ. (China)


Published in SPIE Proceedings Vol. 7159:
2008 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications

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