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Proceedings Paper

An approach to unsupervised hair removal from skin melanoma image
Author(s): Feng-Ying Xie; Shi-Yin Qin; Zhi-Guo Jiang; Ru-Song Meng; Bin Xu
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Paper Abstract

Hair removal from skin melanoma image is one of the key problems for the precise segmentation and analysis of the skin malignant melanoma. In this paper, an automatically hair removal algorithm in dermoscopy images of pigmented skin lesions is proposed. This algorithm includes three steps: firstly, the melanoma image with hairs are enhanced by morphologic closing-based top-hat operator and then segmented through statistic threshold; secondly, the hairs are extracted based on the elongate of connected region; thirdly, the hair-occluded information is repaired by replacing the hair pixels with the nearby non-hair pixels. As a matter of fact, with the morphologic closing-based top-hat operator both strong and weak hairs can be enhanced simultaneously, and the elongate state of band-like connected region can be correctly described by the elongate function proposed in this paper so as to measure the hair effectively. Therefore, the unsupervised hair removal problem in dermoscopy melanoma image can be resolved very well through combining the hair extraction with information repair. The experiment results show that various hairs can be extracted accurately and the repaired effect of textures can satisfy the requirement of medical diagnosis.

Paper Details

Date Published: 13 October 2008
PDF: 8 pages
Proc. SPIE 7127, Seventh International Symposium on Instrumentation and Control Technology: Sensors and Instruments, Computer Simulation, and Artificial Intelligence, 712729 (13 October 2008); doi: 10.1117/12.806726
Show Author Affiliations
Feng-Ying Xie, BeiHang Univ. (China)
Shi-Yin Qin, BeiHang Univ. (China)
Zhi-Guo Jiang, BeiHang Univ. (China)
Ru-Song Meng, General Hospital of the Air Force, PLA. (China)
Bin Xu, BeiHang Univ. (China)


Published in SPIE Proceedings Vol. 7127:
Seventh International Symposium on Instrumentation and Control Technology: Sensors and Instruments, Computer Simulation, and Artificial Intelligence

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