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Proceedings Paper

A novel micro-electromechanical resonant gyroscope
Author(s): Shangchun Fan; Luda Wang; Zhanshe Guo
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Paper Abstract

This paper introduces a new high sensitivity micromachined gyroscope. It is an integrated micromechanical vibratory rate gyroscope based on resonant sensing of the Coriolis force. And it has many advantages over rate gyroscopes that utilize displacement sensing for rotation rate measurement. These advantages include a quasi-digital FM (frequency modulation) output, high resolution, large dynamic range, good linearity, low noise and low power consumption. As a whole, the structure includes proof masses, cantilevers, leverage mechanisms, DETF (double-ended tuning fork), driving and checking combs. The structure parameters' influences on capability parameters are analyzed by MATLAB, the mechanical and model analysis of structure are carried out by ANSYS. At first, we have done the modal analysis in order to make sure the first modality of the structure is the working modality. At the same time, we change some parameters to let the frequencies of other interference modalities much higher than that of the working modality. Then, the harmonic analysis is made to get the information of the sensitivity of the structure. Verified from the simulation results, the sensor can successfully realize the purpose of high precision.

Paper Details

Date Published: 13 October 2008
PDF: 7 pages
Proc. SPIE 7127, Seventh International Symposium on Instrumentation and Control Technology: Sensors and Instruments, Computer Simulation, and Artificial Intelligence, 71270D (13 October 2008); doi: 10.1117/12.806261
Show Author Affiliations
Shangchun Fan, Beihang Univ. (China)
State Key Labs. of Transducer Technology (China)
Luda Wang, Beihang Univ. (China)
State Key Labs. of Transducer Technology (China)
Zhanshe Guo, Beihang Univ. (China)
State Key Labs. of Transducer Technology (China)


Published in SPIE Proceedings Vol. 7127:
Seventh International Symposium on Instrumentation and Control Technology: Sensors and Instruments, Computer Simulation, and Artificial Intelligence

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