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Proceedings Paper

Packaging and characterization of orthogonal transfer array CCDs for the WIYN One Degree Imager
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Paper Abstract

The WIYN One Degree Imager (ODI) will provide a one degree field of view for the WIYN 3.5 m telescope located on Kitt Peak near Tucson, Arizona. Its focal plane will consist of an 8x8 grid of Orthogonal Transfer Array (OTA) CCD detectors with nearly one billion pixels. The implementation of these detectors into the focal plane has required the development of several novel packaging and characterization techniques, which are the subject of this paper. We describe a new packaging/hybridization method in which the CCD die are directly bonded to aluminum nitride ceramic substrates which have indium bump on one side and brazed pins on the other. These custom packages allow good thermal conductivity, a flat imaging surface, four side buttability, and in situ testing of the devices during backside processing. We describe these carriers and the backside processing techniques used with them. We have also modified our cold probing system to screen these OTA die at wafer level to select the best candidates for backside processing. We describe these modifications and characterization results from several wafer lots.

Paper Details

Date Published: 28 January 2009
PDF: 9 pages
Proc. SPIE 7249, Sensors, Cameras, and Systems for Industrial/Scientific Applications X, 72490B (28 January 2009); doi: 10.1117/12.805950
Show Author Affiliations
Michael Lesser, The Univ. of Arizona/Steward Observatory (United States)
David Ouellette, The Univ. of Arizona/Steward Observatory (United States)
Grzegorz Zareba, The Univ. of Arizona/Steward Observatory (United States)
George Jacoby, WIYN Observatory (United States)
Gary Muller, WIYN Observatory (United States)
David Sawyer, WIYN Observatory (United States)
Joe Keyes, WIYN Observatory (United States)
Richard Bredthauer, Semiconductor Technology Associates Inc. (United States)
Kasey Boggs, Semiconductor Technology Associates Inc. (United States)


Published in SPIE Proceedings Vol. 7249:
Sensors, Cameras, and Systems for Industrial/Scientific Applications X
Erik Bodegom; Valérie Nguyen, Editor(s)

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