Share Email Print
cover

Proceedings Paper

16k pixel digital line-scan sensor with 12bit resolution and 40kS/second
Author(s): Martin Wäny; Paulo Franco; Stephan Voltz
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This paper presents a digital line-scan sensor in standard CMOS technology for high resolution scanning application in machine vision, mainly surface inspection of large panel and web materials. The sensor however has due to the unprecedented resolution also application potential in earth observation and motion picture context. The sensor features 16384 charge integrating pixels of 3.5um x 3.5um photo active area. Each pixel has it's own charge integrating transconductance amplifier circuit, a true correlated double sampling stage, sample & hold stage and a pixel level 13 bit linear AD converter. Readout is performed over 16 parallel digital output tap's operated at 50MHz pixel clock. The sensor generates at maximum speed a total data rate of 10.4Gbit/s. In order to maximize the integration time, data readout, AD conversion and integration can be performed simultaneously. Therefore even at the maximum line rate of 43kScans/second the integration time can be maintained at 20us. In order to accommodate for different application scenarios with very different lighting budget's, the sensors full well capacity can be programmed by means of a two step programmable gain from 3000e- to 40ke-. The prototype characterization results showed a total quantum efficiency of 72% at 625nm. With the full well capacity set to 26ke- the conversion gain was measured to be 0.13DN/e- with a read noise in dark of 1.7DN, or 12 e- dark noise equivalent. Over all DSNU is reduced to 3DN rms independent of the conversion gain by the on chip combination of CDS and digital DSNU correction. PRNU was measured according the EMVA1288 standard to 1.2% rms. The sensor is mounted on an "Invar" enforced COB board without glass cover for reduced reflections on optical interface stacks. Instead of traditional package leads SMD mounted board to board connectors are used for the electrical connections.

Paper Details

Date Published: 28 January 2009
PDF: 7 pages
Proc. SPIE 7249, Sensors, Cameras, and Systems for Industrial/Scientific Applications X, 72490F (28 January 2009); doi: 10.1117/12.805667
Show Author Affiliations
Martin Wäny, AWAIBA Lda. (Portugal)
Paulo Franco, AWAIBA Lda. (Portugal)
Stephan Voltz, AWAIBA Lda. (Portugal)


Published in SPIE Proceedings Vol. 7249:
Sensors, Cameras, and Systems for Industrial/Scientific Applications X
Erik Bodegom; Valérie Nguyen, Editor(s)

© SPIE. Terms of Use
Back to Top