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Proceedings Paper

Optimized features allocation technique for improved automated alignment of wafers
Author(s): Michael Parshin; Zeev Zalevsky
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Paper Abstract

In this paper we present a new fuzzy logic based approach for automatic optimized features allocation. The technique is used for improved automatic alignment and classification of silicon wafers and chips that are used in the electronic industry. The proposed automatic image processing approach was realized and experimentally demonstrated in real industrial application with typical wafers. The automatic features allocation and grading supported the industrial requirements and could replace human expert based inspection that currently is performed manually.

Paper Details

Date Published: 3 February 2009
PDF: 12 pages
Proc. SPIE 7251, Image Processing: Machine Vision Applications II, 72510V (3 February 2009); doi: 10.1117/12.804728
Show Author Affiliations
Michael Parshin, Bar-Ilan Univ. (Israel)
Zeev Zalevsky, Bar-Ilan Univ. (Israel)


Published in SPIE Proceedings Vol. 7251:
Image Processing: Machine Vision Applications II
Kurt S. Niel; David Fofi, Editor(s)

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