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Proceedings Paper

Optimizing fused silica polishing processes for 351nm high-power laser application
Author(s): J. Néauport; C. Ambard; H. Bercegol; O. Cahuc; J. P. Champreux; J. L. Charles; P. Cormont; N. Darbois; P. Darnis; J. Destribats; E. Fargin; I. Iordanoff; R. Laheurte; L. Lamaignère; P. Legros; R. Mercier; F. Pilon
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Paper Abstract

During the development of the laser megajoule (LMJ), a high power laser facility dedicated to DT fusion, CEA has made important efforts to understand and improve laser induced damage threshold of fused silica optics at the wavelength of 351 nm. For several years, with various industrials and academics partners, we have focused on optimizing the grinding, lapping and polishing processes to increase materials performance. In this paper, we describe our efforts in various fields: subsurface damage characterization, lapping process simulation, diamond grinding and lapping machine instrumentations, ... Our concern is to control and manage the material removal at each step of the process in order to reduce the cracks region extension and thus to diminish the damage density.

Paper Details

Date Published: 30 December 2008
PDF: 7 pages
Proc. SPIE 7132, Laser-Induced Damage in Optical Materials: 2008, 71321I (30 December 2008); doi: 10.1117/12.804414
Show Author Affiliations
J. Néauport, CEA CESTA (France)
C. Ambard, CEA Le Ripault (France)
H. Bercegol, CEA CESTA (France)
O. Cahuc, LMP, CNRS, Univ. Bordeaux (France)
J. P. Champreux, LMP, CNRS, Univ. Bordeaux (France)
J. L. Charles, LAMEFIP (France)
P. Cormont, CEA CESTA (France)
N. Darbois, CEA CESTA (France)
P. Darnis, LMP, CNRS, Univ. Bordeaux (France)
J. Destribats, CEA CESTA (France)
E. Fargin, ICMCB, CNRS (France)
I. Iordanoff, LAMEFIP (France)
R. Laheurte, LMP, CNRS, Univ. Bordeaux (France)
L. Lamaignère, CEA CESTA (France)
P. Legros, Univ.de Bordeaux II (France)
R. Mercier, Institut d'Optique (France)
F. Pilon, CEA Le Ripault (France)


Published in SPIE Proceedings Vol. 7132:
Laser-Induced Damage in Optical Materials: 2008
Gregory J. Exarhos; Detlev Ristau; M. J. Soileau; Christopher J. Stolz, Editor(s)

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