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Proceedings Paper

Temperature insensitive packaging of FBG based on a flat diaphragm and an L-shaped lever
Author(s): Wentao Zhang; Yuliang Liu; Fang Li
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Paper Abstract

A fiber Bragg grating (FBG) temperature insensitive packaging scheme based on a flat diaphragm and an L shaped lever is presented. The curve where the L shaped lever contacts the diaphragm is a segment of an Archimedes spiral, which is used to reduce the temperature responsivity. Because the thermal expansion coefficient of the quartz-glass L shaped lever and the steel sensor shell is different, the temperature effect is compensated for by optimizing the dimension parameters. Theoretical analysis is presented, and the experimental results show that a low temperature responsivity of 2.8pm/°C are achieved.

Paper Details

Date Published: 11 November 2008
PDF: 5 pages
Proc. SPIE 7134, Passive Components and Fiber-based Devices V, 71340M (11 November 2008); doi: 10.1117/12.803548
Show Author Affiliations
Wentao Zhang, Institute of Semiconductors (China)
Yuliang Liu, Institute of Semiconductors (China)
Fang Li, Institute of Semiconductors (China)

Published in SPIE Proceedings Vol. 7134:
Passive Components and Fiber-based Devices V
Ming-Jun Li; Ping Shum; Ian H. White; Xingkun Wu, Editor(s)

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