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Proceedings Paper

Hybrid integration for advanced photonic devices
Author(s): Alistair Poustie
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Paper Abstract

Hybrid photonic integration with passive assembly techniques allows compact optical modules to be realised with high optical performance and low packaging cost. Recent advances in integrating semiconductor optical amplifiers into practical all-optical signal processing modules is described, with applications from optical memory to sophisticated burst-mode optical regenerators.

Paper Details

Date Published: 12 November 2008
PDF: 10 pages
Proc. SPIE 7135, Optoelectronic Materials and Devices III, 713502 (12 November 2008); doi: 10.1117/12.803089
Show Author Affiliations
Alistair Poustie, CIP Technologies (United Kingdom)

Published in SPIE Proceedings Vol. 7135:
Optoelectronic Materials and Devices III
Yi Luo; Jens Buus; Fumio Koyama; Yu-Hwa Lo, Editor(s)

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