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Proceedings Paper

Thermal stress effects of the interlayer between waveguide cores in buried channel optical waveguides
Author(s): Huamao Huang; Dexiu Huang; Wen Liu; Zuhai Cheng
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Paper Abstract

It is well known that the thermal expansion coefficient of the cladding layer can significantly influence the stress induced birefringence in arrayed waveguide gratings. For the first time, the so-called cladding layer is divided to two parts, i.e. upper cladding and interlayer. The effects of the thermal expansion coefficient, the Young's modulus and the Poisson's ratio of the interlayer, the upper cladding layer and the buffer layer on thermal stresses in buried channel silica-on-silicon optical waveguide cores are studied by use of finite element simulation. The results show that the interlayer between waveguide cores plays the most important role in determining thermal stresses of waveguide cores. The influences of the upper cladding layer and the buffer layer are small, though the former affects slightly larger than the later. By adjusting the thermal expansion coefficient of the interlayer instead of the cladding layer, it is faster to minimize the stress induced birefringence, and the thermal stresses around waveguide cores are almost symmetry. It is also shown that the thermal stress effects of the thermal expansion coefficient and the Poisson's ratio on the cladding layer can be considered as linear superposition of those on the interlayer and the upper cladding layer. However, this conclusion is unsuitable for Young's modulus because of big coupling effect when the thermal expansion coefficient of the interlayer is large.

Paper Details

Date Published: 11 November 2008
PDF: 10 pages
Proc. SPIE 7134, Passive Components and Fiber-based Devices V, 71343N (11 November 2008); doi: 10.1117/12.802506
Show Author Affiliations
Huamao Huang, Huazhong Univ. of Science and Technology (China)
Dexiu Huang, Huazhong Univ. of Science and Technology (China)
Wen Liu, Huazhong Univ. of Science and Technology (China)
Zuhai Cheng, Huazhong Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 7134:
Passive Components and Fiber-based Devices V
Ming-Jun Li; Ping Shum; Ian H. White; Xingkun Wu, Editor(s)

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