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Proceedings Paper

Laser removal of thin layers for surface cleaning
Author(s): Ileana Apostol; D. Apostol; V. Damian; Iuliana Iordache; F. Garoi; E. Capello
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Paper Abstract

In micro- and nano- device fabrication technology, localized material removal is one of the basic operations for structure formation. Classical methods for structure formation on the surface of a silicon wafer are based mainly on chemical processing, starting with photo etching, chemical etching, and chemical-mechanical linearization. In order to propose new methods of higher quality from the point of view of both environment protection and processing quality, we have studied the possibility of thin films controlled removal under the action of laser radiation. We are presenting some qualitative results of laser induced surface removal of polymer thin films, of interest for microelectronic industry (e.g. photoresist), under the action of different laser sources. As laser sources we have used the most spread and commercially available laser systems with different wavelengths and pulse lengths in order to compare their action on the surfaces and to establish the characteristic parameters for removal of thin layers for surface cleaning.

Paper Details

Date Published: 29 April 2008
PDF: 5 pages
Proc. SPIE 7007, INDLAS 2007: Industrial Laser Applications, 70070I (29 April 2008); doi: 10.1117/12.801968
Show Author Affiliations
Ileana Apostol, National Institute for Laser Plasma and Radiation Physics (Romania)
D. Apostol, National Institute for Laser Plasma and Radiation Physics (Romania)
V. Damian, National Institute for Laser Plasma and Radiation Physics (Romania)
Iuliana Iordache, National Institute for Laser Plasma and Radiation Physics (Romania)
F. Garoi, National Institute for Laser Plasma and Radiation Physics (Romania)
E. Capello, Politechnic Univ. of Milan (Italy)


Published in SPIE Proceedings Vol. 7007:
INDLAS 2007: Industrial Laser Applications

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