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Proceedings Paper

The study of CD behavior due to transmission control position change within photomask substrate
Author(s): Munsik Kim; Hyemi Lee; Sungha Woo; Kangjoon Seo; Yongkyoo Choi; Changyeol Kim
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Paper Abstract

As design rule of memory device is smaller and smaller, the CD uniformity of a photomask become the most important factor to satisfy wafer exposure performance. Once the photomask is made, CD uniformity of the mask can't be changed and if CD uniformity of the mask is not good to use for wafer exposure, we must reject it and make another one again. But, after applying transmission control tool for CD uniformity, we have an extra chance to control mask CD uniformity in one mask and this is very effective for wafer printing result. In this paper, we are going to evaluate the behavior of wafer CD due to transmission control position change within photomask substrate and find the optimum control position for better wafer result.

Paper Details

Date Published: 17 October 2008
PDF: 7 pages
Proc. SPIE 7122, Photomask Technology 2008, 712239 (17 October 2008); doi: 10.1117/12.801432
Show Author Affiliations
Munsik Kim, Hynix Semiconductor, Inc. (South Korea)
Hyemi Lee, Hynix Semiconductor, Inc. (South Korea)
Sungha Woo, Hynix Semiconductor, Inc. (South Korea)
Kangjoon Seo, Hynix Semiconductor, Inc. (South Korea)
Yongkyoo Choi, Hynix Semiconductor, Inc. (South Korea)
Changyeol Kim, Hynix Semiconductor, Inc. (South Korea)


Published in SPIE Proceedings Vol. 7122:
Photomask Technology 2008
Hiroichi Kawahira; Larry S. Zurbrick, Editor(s)

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