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Proceedings Paper

Impact of MegaSonic process conditions on PRE and sub-resolution assist feature damage
Author(s): Stefan Helbig; Sabine Urban; Elizabeth Klein; Sherjang Singh
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Paper Abstract

The use of MegaSonic energy is widely accepted in photomask cleaning. For the advanced technology nodes, beyond 65nm, the problem of damaged sub resolution assist features (SRAF) becomes highly prevalent. Such feature damages are often related to the application of MegaSonic energy. We investigated the influence of common cleaning media and MegaSonic parameters for damaging SRAF patterns. A special option of our cleaning tool was utilized to test a large number of different settings with low resources for test mask and defect inspections. In this paper we will present the results of our investigations and present conditions for MegaSonic cleaning which will enable the wide use of this technology beyond the 45nm technology node.

Paper Details

Date Published: 17 October 2008
PDF: 10 pages
Proc. SPIE 7122, Photomask Technology 2008, 712210 (17 October 2008); doi: 10.1117/12.801408
Show Author Affiliations
Stefan Helbig, HamaTech APE (Germany)
Sabine Urban, Advanced Mask Technology Ctr. (Germany)
Elizabeth Klein, Advanced Mask Technology Ctr. (Germany)
Sherjang Singh, Hamatech USA, Inc. (United States)


Published in SPIE Proceedings Vol. 7122:
Photomask Technology 2008
Hiroichi Kawahira; Larry S. Zurbrick, Editor(s)

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