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Proceedings Paper

Accelerated test for effect of moisture and temperature on glass-encapsulant interface
Author(s): Shaofu Wu; Josh Chen; Bert Weaver; Bill Sumner; Victor Juarez
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Paper Abstract

For rigid photovoltaic (PV) cell encapsulation, durable adhesion of the polymeric encapsulant to glass is one of the most important considerations in developing a reliable PV module. The great challenge for encapsulant materials is to obtain adhesion that survives humidity stress at high temperature, since all organic polymers are to some degree permeable to water vapor and water molecules can migrate to the interface and degrade the adhesion. Several test methods were used to accelerate the adhesion degradation process for materials screening. Solar grade EVA and several experimental encapsulant materials were used for the study, which included a detailed analysis of the combined role of moisture and temperature in inducing loss of adhesion. The effect of moisture and temperature on adhesion mechanisms and polymer properties will be discussed.

Paper Details

Date Published: 10 September 2008
PDF: 10 pages
Proc. SPIE 7048, Reliability of Photovoltaic Cells, Modules, Components, and Systems, 70480B (10 September 2008); doi: 10.1117/12.795935
Show Author Affiliations
Shaofu Wu, The Dow Chemical Co. (United States)
Josh Chen, The Dow Chemical Co. (United States)
Bert Weaver, The Dow Chemical Co. (United States)
Bill Sumner, The Dow Chemical Co. (United States)
Victor Juarez, The Dow Chemical Co. (United States)


Published in SPIE Proceedings Vol. 7048:
Reliability of Photovoltaic Cells, Modules, Components, and Systems
Neelkanth G. Dhere, Editor(s)

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