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Proceedings Paper

Packaging and thermal management of photovoltaic cells for high-power applications
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Paper Abstract

Recent improvements in photovoltaic cell technologies have increased efficiency and decreased size to the point that they are much more attractive for use in optically powered and isolated electronics. Applications can include powering a small group of components for simple sensors to much more complex systems which incorporate high speed digital communication between remote locations. Although optical to electrical conversion efficiencies are approaching 50%, the remaining power is still lost as heat. Heat becomes a compound problem because too much can cause photocell efficiency to decrease producing more heat and eventually leading to thermal runaway and breakdown. Thermal management is the key to balancing the maximum amount of input power while minimizing the effect of heat on the efficiency. This paper describes an effort currently under way to develop packaging which combines passive alignment techniques with changes to photocell architecture specifically designed to improve thermal management.

Paper Details

Date Published: 3 September 2008
PDF: 9 pages
Proc. SPIE 7070, Optical Technologies for Arming, Safing, Fuzing, and Firing IV, 70700U (3 September 2008); doi: 10.1117/12.795676
Show Author Affiliations
Jeffrey A. Humphries, Honeywell Federal Manufacturing & Technologies (United States)

Published in SPIE Proceedings Vol. 7070:
Optical Technologies for Arming, Safing, Fuzing, and Firing IV
Fred M. Dickey; Richard A. Beyer, Editor(s)

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