Share Email Print

Proceedings Paper

Silicon optical bench for flip-chip integration of high speed widely tunable lasers
Author(s): M. Chacinski; A. Scholes; R. Schatz; P. Ericsson; M. Isaksson; S. Hammerfeldt
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A silicon optical bench for flip chip mounted widely tunable modulated-grating Y-branch lasers is presented. Its impact on the static and dynamic performance of the laser device is evaluated and compared with a conventional aluminium nitride carrier. The carriers exhibited similar thermal and static performance but the dynamic performance was limited by the electrode layout and the higher microwave losses of the silicon optical bench. With improved microwave design of the electrodes, flip-chip mounting on a silicon optical bench is promising for low cost assembly of high-speed multi-electrode devices.

Paper Details

Date Published: 5 March 2008
PDF: 9 pages
Proc. SPIE 7009, Second International Conference on Advanced Optoelectronics and Lasers, 700904 (5 March 2008); doi: 10.1117/12.793290
Show Author Affiliations
M. Chacinski, Royal Institute of Technology (Sweden)
A. Scholes, Acreo AB (Sweden)
R. Schatz, Royal Institute of Technology (Sweden)
P. Ericsson, Acreo AB (Sweden)
M. Isaksson, Royal Institute of Technology (Sweden)
Syntune AB (Sweden)
S. Hammerfeldt, Syntune AB (Sweden)

Published in SPIE Proceedings Vol. 7009:
Second International Conference on Advanced Optoelectronics and Lasers

© SPIE. Terms of Use
Back to Top