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Proceedings Paper

Optimization of mask absorber stacks and illumination settings for contact hole imaging
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Paper Abstract

This paper reports on the mutual optimization of the mask geometry, mask absorber stack, and illumination settings for arrays of non-quadratic contact holes with different pitches. In contrast to previous work in this field, mask topography effects are fully taken into account. The proposed procedure is enabled by significant performance improvements implemented in the rigorous Waveguide EMF solver and by the application of global optimization techniques. In order to allow for a flexible and efficient interaction, all models and algorithms have been integrated into the Fraunhofer IISB development and research lithography simulation environment Dr.LiTHO. To demonstrate the flexibility of our optimization approaches, we have optimized the imaging of dense and semi-dense arrays of 65nm×90nm contact holes with a 1.35NA water immersion ArF scanner. The process performance is evaluated in terms of overlapping process windows of all relevant feature sizes.

Paper Details

Date Published: 19 May 2008
PDF: 12 pages
Proc. SPIE 7028, Photomask and Next-Generation Lithography Mask Technology XV, 70283L (19 May 2008); doi: 10.1117/12.793128
Show Author Affiliations
Andreas Erdmann, Fraunhofer-Institut of Integrated Systems and Device Technology (Germany)
Tim Fühner, Fraunhofer-Institut of Integrated Systems and Device Technology (Germany)
Peter Evanschitzky, Fraunhofer-Institut of Integrated Systems and Device Technology (Germany)


Published in SPIE Proceedings Vol. 7028:
Photomask and Next-Generation Lithography Mask Technology XV
Toshiyuki Horiuchi, Editor(s)

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